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Samsung overcomes technical challenges, prepared to produce HBM3E chips to Nvidia

Samsung overcomes technical challenges, prepared to produce HBM3E chips to Nvidia

Samsung Electronics has resolved the technical hurdles it confronted in producing 12-layer HBM3E reminiscence chips, efficiently passing Nvidia’s strict qualification exams. In line with individuals accustomed to the matter cited by KED International, the Korean chipmaker will quickly start supplying the high-bandwidth reminiscence required for Nvidia’s AI servers.

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